The high vacuum pump unit, as the core equipment in semiconductor manufacturing, directly determines the wafer yield and production efficiency through precise vacuum control. Its technical characteristics and application value are manifested in the following aspects:

I. Working Principle: A dual-pump configuration of "Rotary Vane Pump + Water Ring Pump" is adopted. The Rotary Vane Pump provides high pumping speed, while the Water Ring Pump establishes the pre-vacuum. The system's ultimate pressure can be reduced to below 1 Pa, breaking through the performance bottleneck of a single pump. This combination combines the water ring pump's ability to tolerate condensable vapors with the high-speed pumping characteristic of the Rotary Vane Pump, meeting the requirements for chemical vapor deposition solvent vapor treatment and the ultra-high vacuum of 10⁻⁶ Pa level for photolithography machines.

II. Application Scenarios: TSV through-hole filling and other processes, multi-stage intelligent degassing technology is used to achieve a 1：20 high-depth-to-width ratio filling； in the dry etching stage, an oil-free screw pump is adopted to reduce the defect rate of the dielectric film layer by 40%; in epoxy molding plastic packaging, a stepped pressure reduction method is employed to compress the bubbles to the micron level， significantly improving the packaging reliability.

III. Selection Rules: The process requirements must be matched by considering four key dimensions. For processes below 7nm, a three-stage rotary vane pump series configuration is adopted, along with PTFE coating for treating acidic vapors. In the photovoltaic scenario, a single-stage vane pump can achieve a maximum pressure of 5Pa. When three pumps are connected in parallel to handle a 50kg/h water vapor load, the suction speed increases by 230%. The CMP slurry recovery system uses a stainless steel water ring pump, with a corrosion rate of less than 0.03mm per year in a pH=2 environment.

IV. Maintenance System: Establish a refined operation and maintenance mechanism. Failure to calibrate the dynamic balance after 2000 hours of operation will result in a 37% failure rate. Implementing double-sided balancing can keep the imbalance measurement within 0.001 ozin. The pre-cooling device reduces energy consumption by 30%, and the fluctuation range of vacuum degree is compressed to within 3%. Online oil monitoring extends the oil change cycle to 800 hours, which is 2.3 times higher than the traditional mode.

Currently, domestic dry vacuum pumps are accelerating the replacement of imported equipment. Hanzhong Jingji's multi-stage rotary vane pump series has obtained SEMI certification and has achieved Class 1-level control of particle contamination in silicon carbide device production, increasing the yield by 2.1 percentage points. As the Chinese semiconductor industry breaks through to nodes below 5nm, the process of achieving autonomy in high vacuum technology will become a key support.